Printed Circuit Board

MAGNETO® Anodes are a critical part of the Printed Circuit Board manufacturing process

About Magneto
Locations
Contact Us

The story of Magneto Special Anodes begins in 1957, when Dr. Henri Beer applied for the patent of the titanium anode. Since then, the company has been through tremendous development.

Evoqua Magneto has three locations based across the globe to support our customers:

Schiedam, Netherlands
Suzhou Industrial Park, Jiangsu Province, China
Union NJ, USA

Hole metallization and plating technology are widely used in PCB manufacturing procedures to solve the key problems of interlayer connection or conduction. In the process of acidic copper plating in PCB, special organic additives are added to generate a metal deposit layer with fine grain, uniform copper distribution on the board and preferable via filling ability. In this process, the coating design of insoluble titanium anode plays a role in ensuring the uniformity of current distribution and controlling the reasonable and effective additive consumption.

Applications

PCB VCP DC Copper Plating
Through hole and blind hole copper plating
Blind hole and through hole via filling plating
PCB RPP Copper Plating Horizontal pulse plating - through hole filling plating
Vertical pulse plating - high aspect ratio through hole plating
PCB Gold Plating
Semiconductor Plating
RTR plating
Lead frame plating

Products and Services

Special Selecta ® mixed metal oxide (MMO) coated titanium anode for VCP
Special mixed metal oxide (MMO) coated titanium anode for RPP
Development of coatings with low consumption of additives (based on specific additive types)
Platinised anode (titanium based or niobium based optional)
Recoating of plate anode (over 3mm)
Quantitative detection of additive consumption (CVS) [Selection Information]

Contact Us

Contact Magneto Special Anodes today!